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C
& H Technology
is
committed to offering the finest quality high power electronics cooling
products for today's and tomorrow's most challenging applications.
Standard
Engineered Heat Sinks · Natural
Convection
Models: Ideal for applications where forced-air cooling isn't an
option. An engineered bonded fin heat sink from C & H Technology can
be up to 50% smaller in size over a comparably performing extruded style
heat sink.
Fan-Forced
Air Convection Models: Single
Fan Forced Air ,
Dual
Fan Forced Air Convection
, Triple
Fan Forced Air Convection
Increased thermal performance over natural convection models. Perfect for
applications using high thermal density semiconductors, such as IGBTs and
MOSFETs.
Forced
air and natural convection profiles are available in a variety of
finishes. The ability to choose from various configurations enables the
engineer to tailor the heat sink profile to meet specific thermal needs of
the application.
Cool-Pak
High Fin Density Heat Sinks:
The high fin density of the Cool-Pak Series increases thermal performance
giving the designer high cooling capacity in a small package.
PowerPak
Impingement Cooling:
This series of heat sinks comes with a ball-bearing Muffin XLä fan. The
impingement cooling allows high speed switching IGBT's and MOSFET modules
to be mounted close together.
CoolPlate
Liquid Cooled Heat Sinks: 1
Pass,
2
Pass,
4
Pass,
6
Pass:
Can handle extremely high heat concentrations with lower device
temperature rise. These cold plates consist of either four or six pass
square copper tubing imbedded within a precision-machined aluminum plate.
DC
to DC Converter
Designed
specifically for high performance cooling of DC to DC power converter
modules. Offered in three sizes—full brick, half brick, and quarter
brick.
We can
assist your engineers in designing the most cost-effective cooling package
for the most diverse applications. Whether you are cooling microprocessors
or large IGBT modules,
C
& H Technology can provide the engineered heat sink to do the job.
Custom
Engineered
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